High-Precision Press Device HPM-44000 for FC-BGA
High-precision coining device with a maximum pressure of 50,000N.
Two models are lined up based on the transport form of the work (substrate): ◆ Tray Type This device transports individual substrates stored in a tray and presses each one individually with four upper and lower heads to flatten the C4 bumps on the substrate with high precision. ◆ Jig Type This device takes individual substrates supplied from a tray, positions them using a dedicated jig, and then presses each one individually with four upper and lower heads to flatten the C4 bumps on the substrate with high precision. As a precision pressing device, it can be applied to various testing and production purposes, including presses for Ag sintering.
- Company：キヤノンマシナリー
- Price：Other
